Circuit World provides a forum for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. The journal is ranked in both Science Citation Index Expanded SCIE (Clarivate Analytics) and Scopus. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes. It is relevant to researchers, senior technical staff, supply chain management, risk assessment and practising engineers. Circuit World covers a broad range of topics, including: Circuit theory, design methodology, analysis and simulation Digital, analog, microwave and optoelectronic integrated circuits Semiconductors, passives, connectors and sensors Electronic packaging of components, assemblies and products PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes) Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal) Internet of Things (IoT)
电路世界为电子电路、元件、组装和产品设计、制造、测试和使用等领域的最新技术、技术论文和社论提供了一个论坛,包括质量、可靠性和安全性。该杂志包括对当今和未来电子技术的各种理论、方法、技术、工艺和应用的多学科研究。该期刊在科学引文索引扩展SCIE(Clarivate Analytics)和Scopus中都排名。 电路世界为研究、应用和当前意识提供了全面、权威的信息源。它与研究人员、高级技术人员、供应链管理、风险评估和执业工程师有关。 电路世界涵盖了广泛的主题,包括: 电路理论、设计方法、分析与仿真 数字、模拟、微波和光电集成电路 半导体、无源、连接器和传感器 零部件、组件和产品的电子包装 印刷电路板设计技术和工艺(控制阻抗、高速印刷电路板、层压板和层压、激光加工和钻孔、成型互连设备、多层板、光学印刷电路板、单面和双面板、焊接和可焊饰面) X的设计(包括可制造性、质量、可靠性、可维护性、持续性、安全性、再利用、处置) 物联网
期刊ISSN
|
0305-6120 |
最新的影响因子
|
0.9 |
最新CiteScore值
|
0.58 |
最新自引率
|
47.50% |
期刊官方网址
|
http://www.emeraldinsight.com/journals.htm?issn=0305-6120 |
期刊投稿网址
|
http://mc.manuscriptcentral.com/cw |
通讯地址
|
EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA |
偏重的研究方向(学科)
|
工程技术-材料科学:综合 |
出版周期
|
Quarterly |
平均审稿速度
|
>12周,或约稿 |
出版年份
|
0 |
出版国家/地区
|
ENGLAND |
是否OA
|
No |
SCI期刊coverage
|
Science Citation Index Expanded(科学引文索引扩展) |
NCBI查询
|
PubMed Central (PMC)链接 全文检索(pubmed central) |
最新中科院JCR分区
|
大类(学科)
小类(学科)
JCR学科排名
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程学,电气和电子) 4区
MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学,跨学科) 4区
245/260
270/285
|
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最新的影响因子
|
0.9 | |||||||
最新公布的期刊年发文量 |
|
|||||||
总被引频次 | 258 | |||||||
特征因子 | 0.000120 | |||||||
影响因子趋势图 |
2007年以来影响因子趋势图(整体平稳趋势)
|
最新CiteScore值
|
0.58
=
引文计数(2018)
文献(2015-2017)
=
41次引用
71篇文献
|
||||||||||
文献总数(2014-2016) | 71 | ||||||||||
被引用比率
|
38% | ||||||||||
SJR
|
0.246 | ||||||||||
SNIP
|
0.362 | ||||||||||
CiteScore排名
|
|
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CiteScore趋势图 |
CiteScore趋势图
|
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scopus涵盖范围 |
scopus趋势图
|
本刊同领域相关期刊
|
|
期刊名称 | IF值 |
LANGMUIR | 3.9 |
Science and Technology of Energetic Materials | 0.5 |
GEOSYNTHETICS INTERNATIONAL | 4.5 |
SENSORS AND MATERIALS | 1.2 |
Smart Materials and Structures | 4.1 |
Carbon Letters | 4.5 |
Materials Horizons | 13.3 |
Advanced Materials Interfaces | 5.4 |
Journal of Materials Education | 0 |
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