Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
半导体加工中的材料科学为讨论光电子、传感器、探测器、生物技术和绿色能源的功能材料和器件的新加工、应用和理论研究提供了一个独特的论坛。 每一期将致力于提供当前的快照的见解、新成果,突破和未来趋势等不同领域的微电子、能源转换和存储、通信、生物技术(图)催化、纳米薄膜技术,混合和复合材料、化学处理、气相沉积、设备制造、和造型的支柱先进半导体加工和应用。 覆盖范围将包括:用于亚微米设备的先进光刻技术;蚀刻及相关课题;离子注入;损害演化及其相关问题;等离子体和热CVD;快速热处理;先进的金属化和互连方案;介质层薄,氧化;溶胶-凝胶法加工;化学浴和(电)化学沉积;化合物半导体加工;新型非氧化物材料及其应用(宏观)分子和杂化材料;分子动力学、从头算方法、蒙特卡罗方法等;分立电路和集成电路的新材料和新工艺;磁性材料和自旋电子学;异质结构和量子器件;半导体光电特性工程;晶体生长机制;可靠性,缺陷密度,固有杂质和缺陷。
期刊ISSN
|
1369-8001 |
最新的影响因子
|
4.1 |
最新CiteScore值
|
2.53 |
最新自引率
|
5.00% |
期刊官方网址
|
http://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description |
期刊投稿网址
|
http://ees.elsevier.com/mssp/ |
通讯地址
|
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB |
偏重的研究方向(学科)
|
工程技术-材料科学:综合 |
出版周期
|
Bimonthly |
平均审稿速度
|
平均1.7个月&来源Elsevier官网:平均3.7周 |
出版年份
|
0 |
出版国家/地区
|
ENGLAND |
是否OA
|
No |
SCI期刊coverage
|
Science Citation Index Expanded(科学引文索引扩展) |
NCBI查询
|
PubMed Central (PMC)链接 全文检索(pubmed central) |
最新中科院JCR分区
|
大类(学科)
小类(学科)
JCR学科排名
物理
ENGINEERING, ELECTRICAL & ELECTRONIC(工程学,电气和电子) 2区
MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学,跨学科) 2区
PHYSICS, APPLIED(物理学,应用) 2区
PHYSICS, CONDENSED MATTER(物理学,凝聚态) 2区
92/260
102/285
49/146
28/67
|
|||||||
最新的影响因子
|
4.1 | |||||||
最新公布的期刊年发文量 |
|
|||||||
总被引频次 | 7465 | |||||||
特征因子 | 0.012310 | |||||||
影响因子趋势图 |
2007年以来影响因子趋势图(整体平稳趋势)
|
最新CiteScore值
|
2.53
=
引文计数(2018)
文献(2015-2017)
=
4236次引用
1673篇文献
|
||||||||||
文献总数(2014-2016) | 1673 | ||||||||||
被引用比率
|
75% | ||||||||||
SJR
|
0.634 | ||||||||||
SNIP
|
0.992 | ||||||||||
CiteScore排名
|
|
||||||||||
CiteScore趋势图 |
CiteScore趋势图
|
||||||||||
scopus涵盖范围 |
scopus趋势图
|
本刊同领域相关期刊
|
|
期刊名称 | IF值 |
SOLID STATE SCIENCES | 3.5 |
IONICS | 2.8 |
SURFACE SCIENCE | 1.9 |
SURFACE SCIENCE REPORTS | 9.8 |
PHYSICS AND CHEMISTRY OF LIQUIDS | 1.2 |
Small | 13.3 |
NANO LETTERS | 10.8 |
ADVANCED MATERIALS | 29.4 |
ADVANCED FUNCTIONAL MATERIALS | 19 |
本刊同分区等级的相关期刊
|
|
期刊名称 | IF值 |
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING | 4.1 |
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2.8 |
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