Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are: Soldering science and technology Novel soldering processes and new solder alloys Surface mount technology (SMT) Surface mount assembly Advanced packaging technologies and 3D interconnects Flip chip/BGA/SiP/TSV Novel substrates and embedded components Solderable finishes and coatings Screen printing Conductive adhesives and conformal coatings Reliability Quality control Inspection and testing Rework and repair Environmental aspects
焊接和表面贴装技术致力于在这一重要领域的知识和专业技术体系内对研究和应用的进展作出重要贡献。焊锡和表面贴装技术是其姊妹出版物，电路世界和微电子国际。 该杂志包括一个多学科研究的关键材料和技术用于组装最先进的功能性电子设备。重点是通过焊接组装设备和互连组件，同时还包括广泛的相关方法。涵盖的主题范围包括： 焊接科学与技术 新的焊接工艺和新的焊接合金 表面贴装技术 表面安装组件 先进的封装技术和3D互连 倒装芯片/BGA/SIP/TSV 新型基板和嵌入式组件 可焊表面和涂层 丝网印刷 导电粘合剂和保形涂层 可靠性 质量控制 检验和测试 返工和修理 环境因素
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期刊ISSN
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0954-0911 |
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最新的影响因子
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2 |
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最新CiteScore值
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N/A |
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最新自引率
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44.90% |
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期刊官方网址
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http://www.emeraldinsight.com/loi/ssmt |
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期刊投稿网址
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通讯地址
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EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA |
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偏重的研究方向（学科）
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工程技术-材料科学：综合 |
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出版周期
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Quarterly |
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平均审稿速度
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>12周，或约稿 |
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出版年份
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0 |
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出版国家/地区
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ENGLAND |
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是否OA
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No |
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SCI期刊coverage
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Science Citation Index Expanded（科学引文索引扩展） |
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NCBI查询
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PubMed Central (PMC)链接 全文检索(pubmed central) |
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最新中科院JCR分区
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大类(学科)
小类(学科)
JCR学科排名
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程学，电气和电子) 3区
ENGINEERING, MANUFACTURING(工程学，制造) 4区
MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学，跨学科) 4区
METALLURGY & METALLURGICAL ENGINEERING(冶金学和冶金工程学) 3区
190/260
40/46
223/285
41/75
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最新的影响因子
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2 | |||||||
| 最新公布的期刊年发文量 |
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| 总被引频次 | 346 | |||||||
| 特征因子 | 0.000210 | |||||||
| 影响因子趋势图 |
2007年以来影响因子趋势图（整体平稳趋势）
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最新CiteScore值
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N/A
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引文计数(2018)
文献(2015-2017)
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N/A次引用
N/A篇文献
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| 文献总数（2014-2016） | N/A | ||||||||||
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被引用比率
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N/A% | ||||||||||
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SJR
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N/A | ||||||||||
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SNIP
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N/A | ||||||||||
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CiteScore排名
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| CiteScore趋势图 |
CiteScore趋势图
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| scopus涵盖范围 |
scopus趋势图
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本刊同领域相关期刊
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| 期刊名称 | IF值 |
| METALLURGIST | 0.9 |
| China Foundry | 1.6 |
| HYDROMETALLURGY | 4.7 |
| WELDING JOURNAL | 2.2 |
| POWDER METALLURGY | 1.4 |
| ISIJ INTERNATIONAL | 1.8 |
| OXIDATION OF METALS | 2.2 |
| Soldagem & Inspecao | 0.6 |
| METALLURGIA ITALIANA | 0.3 |
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本刊同分区等级的相关期刊
|
|
| 期刊名称 | IF值 |
| SOLDERING & SURFACE MOUNT TECHNOLOGY | 2 |
| 分享者 | 点评内容 |
