The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
电子包装杂志发表论文，使用实验和理论(分析和计算机辅助)的方法、方法和技术来解决和解决在电子和光子学组件、设备和系统的分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。
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期刊ISSN
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1043-7398 |
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最新的影响因子
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1.6 |
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最新CiteScore值
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N/A |
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最新自引率
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18.60% |
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期刊官方网址
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http://electronicpackaging.asmedigitalcollection.asme.org/journal.aspx |
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期刊投稿网址
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https://journaltool.asme.org/home/JournalDescriptions.cfm?JournalID=5&Journal=EP |
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通讯地址
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ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990 |
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偏重的研究方向（学科）
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工程技术-工程：电子与电气 |
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出版周期
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Quarterly |
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平均审稿速度
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>12周，或约稿 |
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出版年份
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0 |
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出版国家/地区
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UNITED STATES |
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是否OA
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No |
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SCI期刊coverage
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Science Citation Index Expanded（科学引文索引扩展） |
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NCBI查询
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PubMed Central (PMC)链接 全文检索(pubmed central) |
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最新中科院JCR分区
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大类(学科)
小类(学科)
JCR学科排名
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程学，电气和电子) 2区
ENGINEERING, MECHANICAL(工程学，机械) 2区
106/260
41/128
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最新的影响因子
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1.6 | |||||||
| 最新公布的期刊年发文量 |
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| 总被引频次 | 1252 | |||||||
| 特征因子 | 0.001200 | |||||||
| 影响因子趋势图 |
2007年以来影响因子趋势图（整体平稳趋势）
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最新CiteScore值
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N/A
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引文计数(2018)
文献(2015-2017)
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N/A次引用
N/A篇文献
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| 文献总数（2014-2016） | N/A | ||||||||||
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被引用比率
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N/A% | ||||||||||
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SJR
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N/A | ||||||||||
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SNIP
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N/A | ||||||||||
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CiteScore排名
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| CiteScore趋势图 |
CiteScore趋势图
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| scopus涵盖范围 |
scopus趋势图
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本刊同分区等级的相关期刊
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| 期刊名称 | IF值 |
| JOURNAL OF THE AMERICAN SOCIETY FOR MASS SPECTROMETRY | 3.2 |
| JOURNAL OF MASS SPECTROMETRY | 2.3 |
| NMR IN BIOMEDICINE | 2.9 |
| DRYING TECHNOLOGY | 3.3 |
| TRIBOLOGY LETTERS | 3.2 |
| STRUCTURAL ENGINEERING AND MECHANICS | 2.2 |
| Structure and Infrastructure Engineering | 3.7 |
| JOURNAL OF ELECTRONIC PACKAGING | 1.6 |
| MECHATRONICS | 3.3 |
| 分享者 | 点评内容 |
